packaged pin diodes v 11 advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 1 features ? high power ? fast speed ? voltage ratings to 1500 volts ? wide selection of carrier lifetimes ? wide selection of capacitances ? assortment of packages styles ? available screened for military applications ? rohs compliant description and applications m/a-com tech?s broad line of packaged pin diodes encompass a comprehensive range of electrical characteristics and package outlines. this diverse un- ion of semiconductor technology and chip packaging gives considerable flexibility to the circuit designer. the fast switching series of packaged pin diodes utilize a thin i-region, silicon oxide or glass passivated chip which provides for low leakage current and low inser- tion loss. with the use of in process control monitors to regulate wafer fabrication parameters, these devices will achieve consistent performance in control circuit applications. the high voltage product line of packaged pin diodes employs m/a-com tech's cermachip ? passivation process which provides for a hard glass encapsulation that hermetically seals and protects the active area of the chip. these packaged cermachip ? pin diodes are ideally suited for use in high power ap- plications where high level rf voltages are present. the diode chips are bonded into sealed ceramic pack- ages that are designed for the most stringent electrical and environmental conditions. an extensive choice of package styles are available which may be used in a wide variety of rf microwave circuits. the packaged pin diodes series are designed to have a high inherent reliability and may be ordered screened to meet many mil-std requirements. cathode heatsink packages 30,31,32,36,43,94,111,120, 150,255 258,296,1072,1079 p diss = t (max oper.) - 25c thermal resistance leaded packages +25c 144, 186, 276,1088 p diss = 250mw surface mount package +25c 1056 p diss = 300mw maximum power dissipation co-axial packages leaded/surface mount packages absolute maximum ratings 1 1. operation beyond any one of the above conditions may cause permanent damage to the device. specifications subject to change without prior notification. parameter absolution max. voltage as specified in table operating temperature - 65c to +175c storage temperature - 65c to +200c operating and storage (case style 1088) - 65c to +125c 31,32,94 36 1056 120,255 276 186 30, 296 1088 1072,1079 threaded packages 150 111 43 258 unpackaged die 131,132.134 , 212 thru hole 144
packaged pin diodes v 11 advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 2 notes: 1. the minimum specified v r (reverse voltage) is sourced and the resultant re verse leakage current, ir, is measured to be <10 a 2. at v r = -50v 3. r s measured at i f = +50ma, f = 100mhz. 4. nominal carrier life time specified with diode biased at i f = +10ma , i rev = -6ma case styles 1072, 1079 notes: 1. only available in case styles indicated. 2. the minimum specified v r (reverse voltage) is sourced and the resultant reverse leakage current, ir, is measured to be <10 a. 3. nominal carrier life time specified with diode biased at i f = +10ma , i rev = -6ma 4. ct tested at 100v part number minimum reverse voltage 1 @ i r <10 a volts ( unless otherwise specified ) maximum capacitance c t @ -10v f = 1mhz pf ( unless otherwise specified ) maximum series res. r s @ 10ma f = 500mhz maximum thermal resistance c/w nominal characteristics carrier lifetime 4 ns t rr 5 ns i-region width microns m ma4p203-30 100 0.35 1.50 30 100 20 12 ma4p303-32 200 0.35 1.50 30 200 60 20 ma4p404-30 250 0.40 2 0.70 3 20 1000 100 30 ma4p202-120 100 0.25 2.50 60 60 5 12 100v to 250v fast switching pin diodes specifications (t amb = +25c) part number 1 minimum reverse voltage 2 i r <10 a volts maximum capacitance c t @10v f = 1mhz pf ( unless otherwise specified) maximum series res. r s @10ma f = 100mhz cw power dissipation rating watts nominal characteristics typical i f when r s = 75 ma carrier lifetime 3 s i-region width mils ma4ph235-1072t 35 1.2 0.50 1.0 ? 0.3 0.4 ma4ph236-1072t 600 0.5 3.0 1.0 ? 1.5 2.0 ma4ph237-1079t 200 1.5 0.6@50ma 2.0 ? 3.0 3.0 ma4ph238-1072t 200 0.5 6. 0 1.0 0.30-0.60 2.0 4.0 ma4ph239-1079t 200 0.8 25. 0 2.0 1.20-2.40 6.0 14.0 madp-000234-10720t 500 1.5 4 0.25@100ma 5.0 ? 3.0 2.0 madp-000593-10720t 150 1.5 0.55 10 ? 1.0 21 35v to 500v melf general purpose switching diodes specifications (t amb = +25c) package options consult the ?package availability table? on page 7 for package style choices. package dimensions can be found on the m/a-com technology solutions website 30 31,32, 94 111 120, 255 186 276 1088 1056 chip 1072 131,132
packaged pin diodes v 11 advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 3 part number minimum reverse voltage 1 i r <10 a volts maximum capacitance c t @100v f = 1 mhz pf maximum series resistance r s @100ma f = 100 mhz cw power dissipation rating watts nominal characteristics carrier lifetime 2 s i-region width mils ma4p504-30 500 0.40 0.60 10 1.0 2 madp000015-000030 3 500 0.55 0.45 15 2.0 2 ma4p506-30 500 0.90 0.30 15 3.0 2 500v pin diodes specifications (t amb = +25c) notes: 1. the minimum specified v r (reverse voltage ) is sourced and the resultant re verse leakage current, ir, is measured to be <10 a. 2. nominal carrier life time s pecified with diode biased at i f = +10ma , i rev = -6ma 3. to order this part in a package style other than 30, use t he prefix ma4p505 followed by a dash and the desired package style . specifications subject to cha nge without prior notification . 500v melf pin diode specifications (t amb = +25c) part number minimum reverse voltage 1 i r <10 a volts maximum capacitance c t @100v f = 1 mhz pf maximum series resistance r s @100ma f = 100 mhz cw power dissipation rating watts nominal characteristics carrier lifetime 2 s i-region width mils ma4p504-1072t 500 0.5 0.60 10 1.0 2 ma4p505-1072t 500 0.65 0.45 15 2.0 2 ma4p506-1072t 500 1.0 0.30 15 3.0 2 1072 package notes: 1. the minimum specified v r (reverse voltage) is sourced and the resultant reverse leakage current, ir, is measured to be <10 a. 2. nominal carrier life time specified with diode biased at i f = +10ma , i rev = -6ma package dimensions can be found on the m/a-com technology solutions website. 31 36 111 258 30 120,255 186 131, 212 thru hole 144 package options consult the ?package availability table? on page 7 for package style choices.
packaged pin diodes v 11 advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 4 part number minimum reverse voltage 1 i r <10 a volts maximum capacitance c t @100v f = 1mhz pf maximum series resistance r s @100ma f = 100mhz cw power dissipation rating watts nominal characteristics carrier lifetime 2 s i-region width mils ma4p604-30 1000 0.50 1.00 15 3.0 4 ma4p606-30 1000 0.80 0.70 20 4.0 4 ma4p607-43 1000 2.00 0.40 25 5.0 4 1000v cermachip pin di odes specification (t amb = +25c) notes: 1. the maximum specified v r (reverse voltage) is sourced and the resultant reverse leakage current, ir, is measured to be <10 a 2. nominal carrier life time specified with diode biased at i f = +10ma , i rev = -6ma part number minimum reverse voltage 1 i r <10 a volts maximum capacitance ct @100v f = 1mhz pf maximum series resistance r s @200ma f = 100mhz maximum thermal resistance c/w nominal characteristics carrier lifetime 2 s i-region width mils ma4p709-150 1500 3.30 0.25 2 10.0 7 1500v cermachip pin diode specifications (t amb = +25c) 150 notes: 1. the minimum specified v r (reverse voltage) is sourced and the resultant reverse leakage current, ir, is measured to be <10 a 2. nominal carrier life time specified with diode biased at i f = +10ma , i rev = -6ma specifications subject to change without prior notification. 43 30, 296 36 111 255 258 131, 212 package dimensions can be found on the m/a-com technology solutions website. package options consult the ?package availability table? on page 7 for package style choices.
packaged pin diodes v 11 advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 5 forward current vs. series resistance ma4p202, ma4p203, ma4p303 and ma4p404 100mhz forward current vs. series resistance ma4p504, ma4p505 and ma4p506 100mhz forward current (i f ) series resistance r s ( ) forward current (i f ) series resistance r s ( ) forward current vs. series resistance ma4p709 100mhz forward current (i f ) series resistance r s ( ) forward current vs. series resistance ma4p604, ma4p606 and ma4p607 100mhz forward current (i f ) series resistance r s ( )
packaged pin diodes v 11 advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 6 inspection method condition storage temperature 1031 see maximum ratings operating temperature ?? see maximum ratings temperature cycling 1051 5 cycles - 65c to +150c shock 2016 500g?s vibration 2056 15g?s constant acceleration 2006 20,000g?s humidity 1021 10 days recommended groups b & c testing per mil-std 750 recommended methods and conditions for groups b, c and equivalent tx and txv level screening. inspection method condition internal visual and / or x-ray 2072, 2076 see note high temp. storage 1032 48 hours min. @ max. storage temp. thermal shock 1051 10 cycles constant acceleration 2006 20,000 g's, y1 fine leak 1071 h gross leak 1071 c or e electrical ?? see note burn-in 1038 see note notes: 1. conditions and details of test depend on specific model number. information available upon request. 2. case styles 1056 and 1088 are not military, mil-std-750, rated packages. recommended screening per mil-std 750 recommended methods and conditions for equivalent tx and txv level screening.
packaged pin diodes v 11 advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 7 ordering information the packaged pin diode specifications shown in the tables on pages 2, 3, & 4 are for the standard style package. the standard package style is indicated by the number following the dash after the base part number. note that the specification tables lists the total diode capacitance for the standard case style. the total capacitance for the base part in an alternative package will differ and is computed by adding the junction capacitance of the chip and the parasitic capacitance of the alternative package as defined in the package parasitic capacitance table below. to compute the chip junction capacitance, subtract the total capacitance shown in the specifications tables on pages 2, 3, & 4 from the appropriate standard style package capacitance below the various base part numbers are only available in the case styles shown in the package availability table below. to order, indicate the base part number followed by a dash and the desired package style. for example : the ma4p506-258 is the ma4p506 chip in the 258 style package. maximum soldering temperature for hand soldering operation : case style : 120, 144 , 150*,186, 255, 258*, 276, 1088, 1072, 1079 ? 265c maximum for 5 seconds case style: 30*, 31, 32, 36*, 43*, 94, 111* , 296* ? 225c maximum for 5 seconds. * note: package styles that are threaded or have pronged ends rely on a pressure connection and do not require solder attachment but can be soldered if desired. for solder reflow profiles : refer to application note m-538 on the m/a-com website using the following link: http://www.macomtech.com/application%20notes/pdf/m538.pdf package availability table *note: ?t? after the package style number indicates tape and reel. base part number available ods package styles ma4p202 120, 134, 276, 1056 ma4p203 30, 32, 94, 111, 134, 1056 ma4p303 32, 36, 94, 120, 186, 255, 1088 ma4p404 30, 31, 36, 111, 132, 258,1072t* ma4p504 30, 120, 132, 144, 186, 255,1072t* ma4p505 36, 131, 255, 1072t * ma4p506 30, 31, 36, 131, 255, 258, 1072t * ma4p604 30, 43, 131, 255, 258 ma4p606 30, 36, 131, 258 ma4p607 43, 212, 296 ma4p709 150 madp000015-000030 30 ma4ph235 1072t * ma4ph236 1072t * ma4ph237 1079t * ma4ph238 1072t * ma4ph239 1079t * madp-000234 10720t* (1072 package style) package dimensions can be found on the m/a-com website at http://www.macomtech.com/static/ content.aspx?page=outlinedrawings tape and reel information can be found on the m/a-com website at http://www.macomtech.com/application%20notes/pdf/m513.pdf package style cap. (pf) 30 0.18 31 0.18 32 0.30 36 0.18 43 0.75 94 0.15 111 0.27 120 0.13 131 n/a (chip) 132 n/a (chip) 134 n/a (chip) 186 0.15 212 n/a (chip) 255 0.30 258 0.18 276 0.13 296 0.35 1056 0.20 1072 0.16 1079 0.13 1088 0.12 144 0.42 package parasitic capacitance
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